HDI PCB (1+N+1)

HDI PCB (2+N+2): Moderate Complex HDI

• This structure of HDI PCB contains 2 or more “build-up” of high-density interconnection layers; microvias on different layers can be staggered or stacked; Copper filled stacked microvia structures are commonly seen in challenging designs that demand high level signal transmission performance.

• These are suitable for BGA with smaller ball pitch and higher I/O counts and can be used to increase routing density in a complicated design while maintaining a thin finished board thickness.

• Applications: Cell phone, PDA, game console, portable video recording devices.

 HDI PCB (2+N+2)

ELIC (Every Layer Interconnection): Most Complex HDI

• In this HDI PCB structure, all the layers are high-density interconnection layers which allow the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures.

• This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices while producing superior electrical characteristics.

• Applications: Cell phone, ultra-mobile PC, MP3, GPS, Memory cards, small computer devices.

 ELIC (Every Layer Interconnection)

PCB International strongly recommends sending us the Board Stackup to sales@rpttechpcb.com so we may confirm your desired HDI board design can be successfully manufactured.

rpttechpcb is Professional production low-cost PCB,Cheap PCB, Low price for PCB,94V0

PCB product:4-26 layer board

matelial:FR4 TG170 ,TG150

Material brand：KB,shengyi,taconic,rogers，MEGTRON6，MEGTRON7,Isola

copper thick:1OZ,2OZ.3OZ.4OZ.5OZ

Surface Treatment：ENIG,HASL, OSP,Goldfinger,immersion silver

pcb thickness:1.6MM

low-cost PCB,Cheap PCB, Low price for PCB,94V0 PCB

solder mask:green,red,biue,white,black Silk-Screen:wihte,black,yellowMin Line Width/Space:3/3mil,4/4mil.

If you have any question , please feel free to contact me sales@rpttechpcb.com